Packaging Jobs in Barpeta
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Tata ElectronicsBarpeta
used in OSAT semiconductor packaging operations.
The ideal candidate will possess deep technical knowledge of substrate materials, strong supplier management experience, and a solid understanding of the semiconductor supply chain, particularly...
Fronix ServicesBarpetamncjobsindia.com
Prior experience in the aviation industry is not required but will be considered a plus Benefits
• Competitive salary package
• Opportunities for growth and advancement within the company
• Comprehensive training provided
• Uniform and other work...
Tata ElectronicsBarpeta
used in OSAT semiconductor packaging operations.
The ideal candidate will possess deep technical knowledge of substrate materials, strong supplier management experience, and a solid understanding of the semiconductor supply chain, particularly...
Tata ElectronicsBarpeta
10. 15 years’ experience in IC packaging with strong flip chip exposure.
• Hands on knowledge of Flip chip assembly flows, CTQ, Wafer Bumping & Cu pillar technology, Advanced substrates (FC-BGA, FC-CSP, HDI), Reliability physics for FC packages...
CloudLabs IncIndia
CloudLabs Inc
Email us: info@cloudlabsit.com
What we offer:
• We welcome candidates rejoining the workforce after career break/parental leave and support their journey to reacclimatize too corporate.
• Flexible remote work.
• Competitive pay package...
Tata ElectronicsBarpeta
Test à HVM
• Ensure alignment between package level and board level readiness.
• Manage multiple complex NPI programs simultaneously.
PCBA & System Integration Oversight
• Own PCBA NPI readiness in collaboration with SMEs/Process Engineers.
• Drive...
CloudLabs IncIndia
CloudLabs Inc
Email us: info@cloudlabsit.com
What we offer:
• We welcome candidates rejoining the workforce after a career break/parental leave and support their journey to reacclimatize to the corporate.
• Flexible remote work.
• Competitive pay package...
Tata ElectronicsGoālpāra, 41 km from Barpeta
10. 15 years’ experience in IC packaging with strong flip chip exposure.
• Hands on knowledge of Flip chip assembly flows, CTQ, Wafer Bumping & Cu pillar technology, Advanced substrates (FC-BGA, FC-CSP, HDI), Reliability physics for FC packages...
Next Match AIIndia
and can effectively manage work hours that overlap with both Abu Dhabi (morning/afternoon) and Toronto (evening).
Why This is the Elite Choice in India
• Global Salary Benchmarks: We offer a high-tier compensation package that ranks in the top percentile...
Tata ElectronicsGoālpāra, 41 km from Barpeta
Test à HVM
• Ensure alignment between package level and board level readiness.
• Manage multiple complex NPI programs simultaneously.
PCBA & System Integration Oversight
• Own PCBA NPI readiness in collaboration with SMEs/Process Engineers.
• Drive...
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